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Message
From: Mikhail Matusov<misoma@r...>
Date: Mon Dec 15 19:59:51 CET 2003
Subject: [oc] Prototyping BGA devices
On Mon, 15 Dec 2003 13:52:56 -0400
"Colin F. MacKenzie" <cmackenzie@c...> wrote:
CFM> Hi all, Sorry if this is not exactly about open cores, but I think you
CFM> people can answer my question the best. I was wondering what tools any
CFM> of you who have worked with BGA packaged devices (namely FPGA) have used
CFM> in prototyping your design. I don't have, nor can I really justify to my
CFM> superiors, a rework station. Is there a cheap & dirty method to working
CFM> with BGA such as using solder paste or BGA socket adapters? I will be
CFM> working with a Fine Pitch (1mm) Thin BGA FT256 FPGA.
Usually there is no need to rework FPGAs. When designing, my strategy is
to connect as many signals to the FPGA as possible. I usually end up not
using half of them but so far I managed to avoid board respins for FPGA
pinout reasons. If you are thinking of blowing devices, this in fact is
not so easy to do. Modern FPGAs can take a lot of stress!
The only cases when I needed rework was when an assembly house would
fail to do good job in the first place. It is a good idea to have first
prototypes X-rayed, might save some debugging time.
To summarize, have your boards assembled and inspected by a good
assembly house and you won't need any rework.
--
Mikhail Matusov <misoma@r...>
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