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Message
From: Johann Glaser<Johann.Glaser@g...>
Date: Mon Dec 15 19:16:55 CET 2003
Subject: [oc] Prototyping BGA devices
Hi!> Hi all, Sorry if this is not exactly about open cores, but I think you
> people can answer my question the best. I was wondering what tools any
> of you who have worked with BGA packaged devices (namely FPGA) have
> used in prototyping your design. I don’t have, nor can I really
> justify to my superiors, a rework station. Is there a cheap & dirty
> method to working with BGA such as using solder paste or BGA socket
> adapters? I will be working with a Fine Pitch (1mm) Thin BGA FT256
> FPGA.
There is a "hobby" project:
http://wwwbode.cs.tum.edu/~acher/bga/index.html
This was told me 1-2 years ago on the comp.arch.fpga newsgroup. There
was a huge discussion at this time. Have a look at the archives.
I would recommend to use a normal SMD oven. This shouldn't be too
difficult to get. Probably you can ask some personell at the nearest
university that you can use theirs. Put a lot of flux at your PCB,
adjust the FPGA as carefully as possible and then heat it up and wait.
As the FPGA has solder bumps you don't really need to put solder paste
at the PCB.
The most difficult thing is getting the wires away from the FPGA. Use at
least a 4 layer PCB with fine pitch and small vias. I've been told that
a GND and VCC plane is highly recommended.
Bye
Hansi
--
Johann Glaser <Johann.Glaser@g...>
Vienna University of Technology
Electrical Engineering
____ http://www.johann-glaser.at/ ____
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